VTS
1995
IEEE
13 years 11 months ago
1995
IEEE
To ensure the production of reliable circuits and fully testable unpackaged dies for MCMs burn-in, both dynamic and monitored, remains a feasible option. During this burn-in proce...
ITC
2003
IEEE
14 years 19 days ago
2003
IEEE
An early-life reliability model is presented that allows wafer test information to be used to predict not only the total number of burn-in failures that occur for a given product,...