DAC
2011
ACM
13 years 11 days ago
2011
ACM
Memory consistency litmus tests are small parallel programs that are designed to illustrate subtle differences between memory consistency models by exhibiting different outcomes...
DAC
2011
ACM
13 years 11 days ago
2011
ACM
DVFS remains an important energy management technique for embedded systems. However, its negative impact on transient fault rates has been recently shown. In this paper, we propos...
DAC
2011
ACM
13 years 11 days ago
2011
ACM
We present ChronOS Linux, a best-effort real-time Linux kernel for chip multiprocessors (CMPs). ChronOS addresses the intersection of three problem spaces: a) OS-support for obta...
DAC
2011
ACM
13 years 11 days ago
2011
ACM
The deployment of computer vision algorithms in mobile applications is growing at a rapid pace. A primary component of the computer vision software pipeline is feature extraction,...
DAC
2011
ACM
13 years 11 days ago
2011
ACM
In this work, we propose an efficient and accurate full-chip thermomechanical stress and reliability analysis tool and design optimization methodology to alleviate mechanical rel...
DAC
2011
ACM
13 years 11 days ago
2011
ACM
Modern processor architectures call for software that is highly tuned to an unpredictable operating environment. Processlevel virtualization systems allow existing software to ada...
DAC
2011
ACM
13 years 11 days ago
2011
ACM
SystemC is a popular modeling language which can be used to specify systems at bstraction level. Currently, SystemC tools can not cope with SystemC models for which the module hie...
DAC
2011
ACM
13 years 11 days ago
2011
ACM
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
DAC
2011
ACM
13 years 11 days ago
2011
ACM
Technology scaling allows the integration of billions of transistors on the same die but CAD tools struggle in keeping up with the increasing design complexity. Design productivit...
DAC
2011
ACM
13 years 11 days ago
2011
ACM
Micro-channel cooling shows great potential in removing high density heat in 3D circuits. The current micro-channel heat sink designs spread the entire surface to be cooled with m...