CORR
2008
Springer
14 years 17 days ago
2008
Springer
The reported research work presents numerical studies validated by experimental results of a flat micro heat pipe with sintered copper wick structure. The objectives of this resea...
CORR
2008
Springer
14 years 17 days ago
2008
Springer
This paper presents one MEMS design tool with total six design flows, which makes it possible that the MEMS designers are able to choose the most suitable design flow for their sp...
CORR
2008
Springer
14 years 17 days ago
2008
Springer
In this paper, deep sub-micron CMOS process compatible high Q on chip spiral inductors with air gap structure were designed and fabricated. In the design the electromagnetic solve...
CORR
2008
Springer
14 years 17 days ago
2008
Springer
The extensive research and development of micromechanical resonators is trying to allow the use of these devices for highly sensitive applications. Microcantilevers are some of th...
CORR
2008
Springer
14 years 17 days ago
2008
Springer
Online monitoring remains an important requirement for a range of microsystems. The solution based on the injection of an actuating test stimulus into the bias structure of active...
CORR
2008
Springer
14 years 17 days ago
2008
Springer
CORR
2008
Springer
14 years 17 days ago
2008
Springer
A new Room Temperature (RT) 0-level vacuum package is demonstrated in this work, using amorphous silicon (aSi) as sacrificial layer and SiO2 as structural layer. The process is co...
CORR
2008
Springer
14 years 17 days ago
2008
Springer
The preamplifier is a critical component of gyrometer's electronics. Indeed the resolution of the sensor is limited by its signal to noise ratio, and the gyrometer's the...
CORR
2008
Springer
14 years 17 days ago
2008
Springer
We propose the design of a reconfigurable impedance matching network for the lower RF frequency band, based on a developed RF-MEMS technology. The circuit is composed of RF-MEMS o...
CORR
2008
Springer
14 years 17 days ago
2008
Springer
Deep reactive ion etching (DRIE) of borosilicate glass and profile control of an etched groove are reported. DRIE was carried out using an anodically bonded silicon wafer as an et...