Sciweavers

DAC
2009
ACM
14 years 8 months ago
Spare-cell-aware multilevel analytical placement
Post-silicon validation has recently drawn designers' attention due to its increasing impacts on the VLSI design cycle and cost. One key feature of the post-silicon validatio...
Zhe-Wei Jiang, Meng-Kai Hsu, Yao-Wen Chang, Kai-Yu...
DAC
2009
ACM
14 years 8 months ago
Handling complexities in modern large-scale mixed-size placement
In this paper, we propose an effective algorithm flow to handle largescale mixed-size placement. The basic idea is to use floorplanning to guide the placement of objects at the gl...
Jackey Z. Yan, Natarajan Viswanathan, Chris Chu
DAC
2009
ACM
14 years 8 months ago
Spectral techniques for high-resolution thermal characterization with limited sensor data
Elevated chip temperatures are true limiters to the scalability of computing systems. Excessive runtime thermal variations compromise the performance and reliability of integrated...
Ryan Cochran, Sherief Reda
DAC
2009
ACM
14 years 8 months ago
Dynamic thermal management via architectural adaptation
Exponentially rising cooling/packaging costs due to high power density call for architectural and software-level thermal management. Dynamic thermal management (DTM) techniques co...
Ramkumar Jayaseelan, Tulika Mitra
DAC
2009
ACM
14 years 8 months ago
SRAM parametric failure analysis
With aggressive technology scaling, SRAM design has been seriously challenged by the difficulties in analyzing rare failure events. In this paper we propose to create statistical ...
Jian Wang, Soner Yaldiz, Xin Li, Lawrence T. Pileg...
DAC
2009
ACM
14 years 8 months ago
Improving testability and soft-error resilience through retiming
State elements are increasingly vulnerable to soft errors due to their decreasing size, and the fact that latched errors cannot be completely eliminated by electrical or timing ma...
Smita Krishnaswamy, Igor L. Markov, John P. Hayes
DAC
2009
ACM
14 years 8 months ago
Statistical reliability analysis under process variation and aging effects
Circuit reliability is affected by various fabrication-time and run-time effects. Fabrication-induced process variation has significant impact on circuit performance and reliabilit...
Yinghai Lu, Li Shang, Hai Zhou, Hengliang Zhu, Fan...
DAC
2009
ACM
14 years 8 months ago
Provably good and practically efficient algorithms for CMP dummy fill
Abstract--To reduce chip-scale topography variation in Chemical Mechanical Polishing (CMP) process, dummy fill is widely used to improve the layout density uniformity. Previous res...
Chunyang Feng, Hai Zhou, Changhao Yan, Jun Tao, Xu...
DAC
2009
ACM
14 years 8 months ago
Event-driven gate-level simulation with GP-GPUs
Logic simulation is a critical component of the design tool flow in modern hardware development efforts. It is used widely ? from high-level descriptions down to gate-level ones ?...
Debapriya Chatterjee, Andrew DeOrio, Valeria Berta...