ASPDAC
2009
ACM
14 years 7 months ago
2009
ACM
ASPDAC
2009
ACM
14 years 7 months ago
2009
ACM
ASPDAC
2009
ACM
14 years 7 months ago
2009
ACM
ASPDAC
2009
ACM
14 years 7 months ago
2009
ACM
Three-dimensional stacking of silicon layers is emerging as a promising solution to handle the design complexity and heterogeneity of Systems on Chips (SoCs). Networks on Chips (N...
ASPDAC
2009
ACM
14 years 7 months ago
2009
ACM
Abstract— In the context of a design space exploration framework for supporting the platform-based design approach, we address the problem of robustness with respect to manufactu...
ASPDAC
2009
ACM
14 years 7 months ago
2009
ACM
ASPDAC
2009
ACM
14 years 7 months ago
2009
ACM
Abstract— In an effort to make processors more power efficient scratch pad memory (SPM) have been proposed instead of caches, which can consume majority of processor power. Howe...
ASPDAC
2009
ACM
14 years 7 months ago
2009
ACM
In response to the increasing variations in integrated-circuit manufacturing, the current trend is to create designs that take these variations into account statistically. In this...
ASPDAC
2009
ACM
14 years 7 months ago
2009
ACM
Low power circuits have become a necessary part in modern designs. Retention flip-flop is one of the most important components in low power designs. Conventional test methodologie...
ASPDAC
2009
ACM
14 years 7 months ago
2009
ACM
