Linear programming (LP) based methods are attractive for solving the placement problem because of their ability to model Half-Perimeter Wirelength (HPWL) and timing. However, it h...
APlace is a high quality, scalable analytical placer. This paper describes our recent efforts to improve APlace for speed and scalability. We explore various wirelength and densi...
The existing decoupling capacitance optimization approaches meet constraints on input impedance for package. In this paper, we show that using impedance as constraints leads to la...
The multilevel placement package mPL6 combines improved implementations of the global placer mPL5 (ISPD05) and the XDP legalizer and detailed placer (ASPDAC06). It consistently pr...
Tony F. Chan, Jason Cong, Joseph R. Shinnerl, Kent...
The integration of retiming and simultaneous supply/threshold voltage scaling has a potential to enable more rigorous total power reduction. However, such integration is a highly ...