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This paper presents an electrical and thermal performance analysis of System-in-a-Package (SiP) memory/logic implementation platform based on ChipLaminate-Chip (CLC) technology. I...
Michael X. Wang, Katsuharu Suzuki, Wayne Wei-Ming ...
The importance of an interconnect pattern density model in ASIC design flow for a 90nm technology is presented. It is shown that performing the timing analysis at the worst-case c...
Payman Zarkesh-Ha, S. Lakshminarayann, Ken Doniger...
In this paper an embedded IDDQ testing architecture is presented that targets to overcome the excessive hardware overhead requirements in built-in current sensing based testing ap...
The amplitude of coupled noise is often used in estimating the crosstalk effect. Coupling noise-induced delay measures the impact of crosstalk on circuit performance. Efficient c...
The internal-switching induced simultaneous switching noise (SSN) is studied in the paper. Unlike ground bounce caused by driving off-chip loading, both power-rail and ground-rail...
As the portion of coupling capacitance increases in smaller process geometries, accurate coupled noise analysis is becoming more important in current design methodologies. We prop...
Jae-Seok Yang, Jeong-Yeol Kim, Joon-Ho Choi, Moon-...
In this paper, an algorithm for the coupled simulation of circuit and piezoelectric laminate devices is presented. A finite element solver for piezoelectric laminates is included ...
Inductance associated with on-chip wires can no longer be ignored as chip operation frequencies increase into GHz regime. Because the magnetic field propagates a very long range, ...
S. Simon Wong, C. Patrick Yue, Richard Chang, So-Y...
In this paper, we propose a new physical synthesis methodology, PDL, which relaxes the timing constraints to obtain best optimality in terms of layout quality and timing quality. ...