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JETC
2008
41views more  JETC 2008»
13 years 11 months ago
Investigating the effects of fine-grain three-dimensional integration on microarchitecture design
Yuchun Ma, Yongxiang Liu, Eren Kursun, Glenn Reinm...
JETC
2008
127views more  JETC 2008»
13 years 11 months ago
Automated module assignment in stacked-Vdd designs for high-efficiency power delivery
With aggressive reductions in feature sizes and the integration of multiple functionalities on the same die, bottlenecks due to I/O pin limitations have become a severe issue in to...
Yong Zhan, Sachin S. Sapatnekar
JETC
2008
62views more  JETC 2008»
14 years 17 days ago
PicoServer: Using 3D stacking technology to build energy efficient servers
Taeho Kgil, Ali G. Saidi, Nathan L. Binkert, Steve...
JETC
2008
50views more  JETC 2008»
14 years 17 days ago
Parametric yield management for 3D ICs: Models and strategies for improvement
Cesare Ferri, Sherief Reda, R. Iris Bahar
JETC
2008
44views more  JETC 2008»
14 years 17 days ago
High-level interconnect model for the quantum logic array architecture
Tzvetan S. Metodi, Darshan D. Thaker, Andrew W. Cr...
JETC
2008
74views more  JETC 2008»
14 years 17 days ago
Arithmetic on a distributed-memory quantum multicomputer
Rodney Van Meter, W. J. Munro, Kae Nemoto, Kohei M...
JETC
2008
68views more  JETC 2008»
14 years 17 days ago
High-level synthesis of digital microfluidic biochips
Fei Su, Krishnendu Chakrabarty