Sciweavers

MJ
2011
288views Multimedia» more  MJ 2011»
13 years 6 months ago
Emulation-based transient thermal modeling of 2D/3D systems-on-chip with active cooling
New tendencies envisage 2D/3D Multi-Processor System-On-Chip (MPSoC) as a promising solution for the consumer electronics market. MPSoCs are complex to design, as they must execute...
Pablo Garcia Del Valle, David Atienza
ICCAD
2010
IEEE
145views Hardware» more  ICCAD 2010»
13 years 9 months ago
Fuzzy control for enforcing energy efficiency in high-performance 3D systems
3D stacked circuits reduce communication delay in multicore system-on-chips (SoCs) and enable heterogeneous integration of cores, memories, sensors, and RF devices. However, vertic...
Mohamed M. Sabry, Ayse Kivilcim Coskun, David Atie...