Sciweavers

    ICCAD
    2008
    IEEE
    161views Hardware» more  ICCAD 2008»
    A low-overhead fault tolerance scheme for TSV-based 3D network on chip links
    14 years 8 months ago
    A low-overhead fault tolerance scheme for TSV-based 3D network on chip links
    Download  www-micrel.deis.unibo.it
    — Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
    Igor Loi, Subhasish Mitra, Thomas H. Lee, Shinobu ...
    claim paper
    Read More »
    Explore & Download
    Proceedings Preprints Top 5 Ranked Papers Publications Books Software Tutorials Presentations Lectures Notes Datasets
    Productivity Tools
    International On-screen Keyboard Graphical Social Symbols OCR Text Recognition CSS3 Style Generator Web Page to PDF Web Page to Image PDF Split PDF Merge Latex Equation Editor Sci2ools
    Document Tools
    PDF to Text PDF to Postscript PDF to Thumbnails Excel to PDF Word to PDF Postscript to PDF PowerPoint to PDF Latex to Word Repair Corrupted PDF
    Image Tools
    JPG to PS JPG to PDF Extract Images from PDF Image Converter
    Sciweavers
    About Community Cookies Privacy Policy Terms of Use

    Copyright © Sciweavers LLC, 2009-2024, USA.