MR
2002
13 years 10 months ago
2002
MR
2002
13 years 10 months ago
2002
Generally, tantalum capacitor failure modes have been discussed both for the standard manganese dioxide cathode and the new conductive polymer (CP) type. For standard tantalum in ...
MR
2002
13 years 10 months ago
2002
- This paper discusses the previously unexplored initial front rise differences between Real HBM, TLP and HBM tester waveshapes. The dV/dt of the HBM test pulse amplitude below 2% ...
MR
2002
13 years 10 months ago
2002
This paper reviews the main failure mechanisms occurring in modern power modules paying special attention to insulated gate bipolar transistor devices for high-power applications....
MR
2002
13 years 10 months ago
2002
MR
2002
13 years 10 months ago
2002
Experiments are described in this paper whose results suggest a clear mathematical relationship between total circuit resistance (including the capacitor's ESR) and the volta...
MR
2002
13 years 10 months ago
2002
This paper presents an approach to the analysis of transient thermal states in electronic circuits using an analytical solution of the heat equation. Fully three-dimensional analy...
MR
2002
13 years 10 months ago
2002
In the flip-chip assembly process, no-flow underfill materials have a particular advantage over traditional underfill: the application and curing of the former can be undertaken b...
MR
2002
13 years 10 months ago
2002
ESD protection design for CMOS RF integrated circuits is proposed in this paper by using the stacked polysilicon diodes as the input ESD protection devices to reduce the total inp...
MR
2002
13 years 10 months ago
2002
Gold to Gold Interconnection (GGI) flip chip bonding technology has been developed to bond the driver IC chip on the integrated circuit suspension used in hard disk drives (HDDs)....