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MR
2008
94views Robotics» more  MR 2008»
13 years 11 months ago
Stress intensities at the triple junction of a multilevel thin film package
Stress intensities of a singular near-tip field around the vertex of a triple junction wedge in multilevel thin film packages are calculated using the two-state M-integral. For th...
Insu Jeon, Ki-Ju Kang, Seyoung Im
MR
2008
86views Robotics» more  MR 2008»
13 years 11 months ago
Effects of bonding temperature on the properties and reliabilities of anisotropic conductive films (ACFs) for flip chip on organ
The effects of bonding temperatures on the composite properties and reliability performances of anisotropic conductive films (ACFs) for flip chip on organic substrates assemblies ...
J. S. Hwang, M. J. Yim, K. W. Paik
MR
2008
88views Robotics» more  MR 2008»
13 years 11 months ago
Characterization of semiconductor interfaces using a modified mixed mode bending apparatus
This research deals with the experimental assessment of the strength of bi-material interfaces as a function of mode mixity, focusing on two dimensional problems. A modified mixed...
J. Thijsse, Olaf van der Sluis, J. A. W. van Domme...
MR
2008
76views Robotics» more  MR 2008»
13 years 11 months ago
PMOS breakdown effects on digital circuits - Modeling and analysis
Weidong Kuang, Lizhi Cao, C. Yu, J. S. Yuan
MR
2008
275views Robotics» more  MR 2008»
13 years 11 months ago
A MEMS-based wireless multisensor module for environmental monitoring
Mathieu Hautefeuille, Conor O'Mahony, Brendan O'Fl...
MR
2008
78views Robotics» more  MR 2008»
13 years 11 months ago
Dependency of thermal spreading resistance on convective heat transfer coefficient
This paper presents a study of the thermal spreading resistance Rth of a small heat source on a conductive substrate subject to bottomside convective cooling. This problem has bee...
Bjorn Vermeersch, Gilbert De Mey