MR 2008 | Sciweavers

28

MR
2008

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Stress intensities at the triple junction of a multilevel thin film package

13 years 10 months ago

Stress intensities of a singular near-tip field around the vertex of a triple junction wedge in multilevel thin film packages are calculated using the two-state M-integral. For th...

Insu Jeon, Ki-Ju Kang, Seyoung Im

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26

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MR
2008

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Effects of bonding temperature on the properties and reliabilities of anisotropic conductive films (ACFs) for flip chip on organ

13 years 10 months ago

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The effects of bonding temperatures on the composite properties and reliability performances of anisotropic conductive films (ACFs) for flip chip on organic substrates assemblies ...

J. S. Hwang, M. J. Yim, K. W. Paik

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26

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MR
2008

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Characterization of semiconductor interfaces using a modified mixed mode bending apparatus

13 years 10 months ago

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This research deals with the experimental assessment of the strength of bi-material interfaces as a function of mode mixity, focusing on two dimensional problems. A modified mixed...

J. Thijsse, Olaf van der Sluis, J. A. W. van Domme...

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15

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MR
2008

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PMOS breakdown effects on digital circuits - Modeling and analysis

13 years 10 months ago

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Weidong Kuang, Lizhi Cao, C. Yu, J. S. Yuan

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33

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MR
2008

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A MEMS-based wireless multisensor module for environmental monitoring

13 years 10 months ago

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Mathieu Hautefeuille, Conor O'Mahony, Brendan O'Fl...

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20

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MR
2008

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Fractal description of dendrite growth during electrochemical migration

13 years 10 months ago

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Csaba Dominkovics, Gábor Harsányi

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19

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MR
2008

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Reliability- and process-variation aware design of integrated circuits

13 years 10 months ago

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M. Alam

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22

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MR
2008

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Dependency of thermal spreading resistance on convective heat transfer coefficient

13 years 10 months ago

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This paper presents a study of the thermal spreading resistance Rth of a small heat source on a conductive substrate subject to bottomside convective cooling. This problem has bee...

Bjorn Vermeersch, Gilbert De Mey

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