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MR
2008

Effects of bonding temperature on the properties and reliabilities of anisotropic conductive films (ACFs) for flip chip on organ

13 years 11 months ago
Effects of bonding temperature on the properties and reliabilities of anisotropic conductive films (ACFs) for flip chip on organ
The effects of bonding temperatures on the composite properties and reliability performances of anisotropic conductive films (ACFs) for flip chip on organic substrates assemblies were studied. As the bonding temperature decreased, the composite properties of ACF, such as water absorption, glass transition temperature (Tg), elastic modulus (E0 ) and coefficient of thermal expansion (a), were improved. These results were due to the difference in network structures of cured ACFs which were fully cured at different temperatures. From small angle X-ray scattering (SAXS) test result, ACFs cured at lower temperature, had denser network structures. The reliability performances of flip chip on organic substrate assemblies using ACFs were also investigated as a function of bonding temperatures. The results in thermal cycling test (
J. S. Hwang, M. J. Yim, K. W. Paik
Added 28 Dec 2010
Updated 28 Dec 2010
Type Journal
Year 2008
Where MR
Authors J. S. Hwang, M. J. Yim, K. W. Paik
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