MTDT
1999
IEEE
14 years 4 months ago
1999
IEEE
This paper presents characterization methods for an SDRAM in a manufacturing environment. Contact tests, dc tests, basic functional tests, signal margin tests and retention charac...
MTDT
1999
IEEE
14 years 4 months ago
1999
IEEE
MTDT
1999
IEEE
14 years 4 months ago
1999
IEEE
Continuing improvements in semiconductor fabrication density are enabling new classes of System-on-aChip architectures that combine extensive processing logic and high-density mem...
MTDT
1999
IEEE
14 years 4 months ago
1999
IEEE
The new concept of an unbalanced, hierarchicallydivided cache memory system is introduced and analyzed. This approach generalizes existing cache structures by allowing different m...
MTDT
1999
IEEE
14 years 4 months ago
1999
IEEE
It seems likely that density concerns will force the DRAM community to consider using radically different schemes for the implementation of memory devices. We propose using nano-s...