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ICCAD
2010
IEEE
102views Hardware» more  ICCAD 2010»
13 years 9 months ago
Yield enhancement for 3D-stacked memory by redundancy sharing across dies
Three-dimensional (3D) memory products are emerging to fulfill the ever-increasing demands of storage capacity. In 3D-stacked memory, redundancy sharing between neighboring vertic...
Li Jiang, Rong Ye, Qiang Xu