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ICCAD
2004
IEEE
88views Hardware» more  ICCAD 2004»
14 years 9 months ago
Interconnect lifetime prediction under dynamic stress for reliability-aware design
Thermal effects are becoming a limiting factor in highperformance circuit design due to the strong temperaturedependence of leakage power, circuit performance, IC package cost and...
Zhijian Lu, Wei Huang, John Lach, Mircea R. Stan, ...