DATE
2010
IEEE
14 years 8 months ago
2010
IEEE
—Recent research has shown that different defects can manifest themselves as failures at different temperature spectra. Therefore, we need multi-temperature testing which applies...
DSD
2009
IEEE
14 years 10 months ago
2009
IEEE
—Long test application time and high temperature have become two major issues of system-on-chip (SoC) test. In order to minimize test application times and avoid overheating duri...