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ICCAD
2005
IEEE
134views Hardware» more  ICCAD 2005»
14 years 6 months ago
Fast thermal simulation for architecture level dynamic thermal management
As power density increases exponentially, runtime regulation of operating temperature by dynamic thermal managements becomes necessary. This paper proposes a novel approach to the...
Pu Liu, Zhenyu Qi, Hang Li, Lingling Jin, Wei Wu, ...
DATE
2006
IEEE
152views Hardware» more  DATE 2006»
14 years 6 months ago
Adaptive chip-package thermal analysis for synthesis and design
Ever-increasing integrated circuit (IC) power densities and peak temperatures threaten reliability, performance, and economical cooling. To address these challenges, thermal analy...
Yonghong Yang, Zhenyu (Peter) Gu, Changyun Zhu, Li...