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29
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DATE
2006
IEEE
114
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DATE 2006
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3D floorplanning with thermal vias
14 years 6 months ago
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www.gtcad.gatech.edu
Abstract— 3D circuits have the potential to improve performance over traditional 2D circuits by reducing wirelength and interconnect delay. One major problem with 3D circuits is ...
Eric Wong, Sung Kyu Lim
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