3D floorplanning with thermal vias

Abstract— 3D circuits have the potential to improve performance over traditional 2D circuits by reducing wirelength and interconnect delay. One major problem with 3D circuits is that their higher device density due to reduced footprint area leads to greater temperatures. Thermal vias are a potential solution to this problem. This paper presents a thermal via insertion algorithm that can be used to plan thermal via locations during floorplanning. The thermal via insertion algorithm relies on a new thermal analyzer based on random walk techniques. Experimental results show that, in many cases, considering thermal vias during floorplanning stages can significantly reduce the temperature of a 3D circuit.

• Type: Conference
• Year: 2006
• Where: DATE
• Authors: Eric Wong, Sung Kyu Lim
• Keywords: DATE 2006, Hardware, Insertion Algorithm, Thermal Via Insertion, Thermal Vias