— In the past, dynamic voltage and frequency scaling (DVFS) has been widely used for power and energy optimization in embedded system design. As thermal issues become increasingl...
Yongpan Liu, Huazhong Yang, Robert P. Dick, Hui Wa...
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...