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    ICCAD
    2008
    IEEE
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    A low-overhead fault tolerance scheme for TSV-based 3D network on chip links
    14 years 9 months ago
    A low-overhead fault tolerance scheme for TSV-based 3D network on chip links
    Download  www-micrel.deis.unibo.it
    — Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
    Igor Loi, Subhasish Mitra, Thomas H. Lee, Shinobu ...
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