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    ICCD
    2007
    IEEE
    139views Hardware» more  ICCD 2007»
    Whitespace redistribution for thermal via insertion in 3D stacked ICs
    14 years 8 months ago
    Whitespace redistribution for thermal via insertion in 3D stacked ICs
    Download  www.gtcad.gatech.edu
    One of the biggest challenges in 3D stacked IC design is heat dissipation. Incorporating thermal vias is a promising method for reducing the temperatures of 3D ICs. The bonding st...
    Eric Wong, Sung Kyu Lim
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