Sciweavers

    ASPDAC
    2009
    ACM
    104views Hardware» more  ASPDAC 2009»
    Addressing thermal and power delivery bottlenecks in 3D circuits
    14 years 7 months ago
    Addressing thermal and power delivery bottlenecks in 3D circuits
    Download  www.ece.umn.edu
    — The enhanced packing densities facilitated by 3D integrated circuit technology also has an unwanted side-effect, in the form of increasing the amount of current per unit footpr...
    Sachin S. Sapatnekar
    claim paper
    Read More »
    Explore & Download
    Proceedings Preprints Top 5 Ranked Papers Publications Books Software Tutorials Presentations Lectures Notes Datasets
    Productivity Tools
    International On-screen Keyboard Graphical Social Symbols OCR Text Recognition CSS3 Style Generator Web Page to PDF Web Page to Image PDF Split PDF Merge Latex Equation Editor Sci2ools
    Document Tools
    PDF to Text PDF to Postscript PDF to Thumbnails Excel to PDF Word to PDF Postscript to PDF PowerPoint to PDF Latex to Word Repair Corrupted PDF
    Image Tools
    JPG to PS JPG to PDF Extract Images from PDF Image Converter
    Sciweavers
    About Community Cookies Privacy Policy Terms of Use

    Copyright © Sciweavers LLC, 2009-2024, USA.