TASE
2011
IEEE
13 years 6 months ago
2011
IEEE
—For multiclass flow line models, we identify a class of service times that allow a decomposition of the system into subsets of servers called channels. In each channel, the cus...
CCE
2006
13 years 11 months ago
2006
In the past few years, Rapid Thermal Processes (RTP) have gained acceptance as mainstream technology for semi-conductors manufacturing. These processes are characterized by a sing...
WSC
2000
14 years 25 days ago
2000
Designing semiconductor cluster tool systems is a complicated task due to the nature of automatic operations and various configurations of modules and task response priorities of ...
WSC
2007
14 years 1 months ago
2007
The transition to 300mm wafer size introduced a lot of new technologies to wafer fabrication facilities that mandated the presence of intrabay automated material handling systems ...
DATE
2010
IEEE
14 years 4 months ago
2010
IEEE
—3D integration is a key solution to the predicted performance increase of future electronic systems. It offers extreme miniaturization and fabrication of More than Moore product...