FPL
2006
Springer
14 years 4 months ago
2006
Springer
As manufacturing technology enters the ultra-deep submicron era, wafer yields are destined to drop due to higher occurrence of physical defects on the die. This paper proposes a y...
ICCD
2007
IEEE
14 years 9 months ago
2007
IEEE
The deployment of future deep submicron technology calls for a careful review of existing cache organizations and design practices in terms of yield and performance. This paper pr...