Burn-in Temperature Projections for Deep Sub-micron Technologies

Burn-in faces significant challenges in recent CMOS technologies. The self-generated heat of each IC in a burn-in environment contributes to larger currents that can lead to further increase in junction temperatures, possible thermal run away, and yield-loss of good parts. Calculations show that the junction temperature is

• Type: Conference
• Year: 2003
• Where: ITC
• Authors: Oleg Semenov, Arman Vassighi, Manoj Sachdev, Ali Keshavarzi, Charles F. Hawkins
• Keywords: Burn-in Environment, Burn-in Faces, Hardware, ITC 2003, Junction Temperature