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    3D thermal-ADI: an efficient chip-level transient thermal simulator

    14 years 4 months ago
    3D thermal-ADI: an efficient chip-level transient thermal simulator
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    Ting-Yuan Wang, Yu-Min Lee, Charlie Chung-Ping Che
    claim paper
    Added 05 Jul 2010
    Updated 05 Jul 2010
    Type Conference
    Year 2003
    Where ISPD
    Authors Ting-Yuan Wang, Yu-Min Lee, Charlie Chung-Ping Chen
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