A robotic system is developed to automate the packing of polycrystalline silicon nuggets into a fragile fused silica crucible in CZ semiconductor wafer production. The highly irregular shapes of the nuggets make this a difficult and challenging task. In this system, nugget grasping is done with a three-cup suction gripper and nugget manipulation is attained with a 7 DOF SCARA manipulator. An optical 3-D vision system, based on active laser triangulation, measures nugget and crucible profiles. A model-free Virtual Trial and Error packing algorithm determines optimal nugget placement in real time. A hybrid position-force control scheme has been implemented and tested for physical nugget placement. The integrated system achieves high production rates, required precision and cost effectiveness.
Vivek A. Sujan, Steven Dubowsky, Yoshiaki Ohkami