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DAC
1999
ACM

Interconnect Analysis: From 3-D Structures to Circuit Models

14 years 3 months ago
Interconnect Analysis: From 3-D Structures to Circuit Models
In this survey paper we describethe combination of: discretized integral formulations, sparsication techniques, and krylov-subspace based model-order reduction that has led to robust tools for automatic generation of macromodels that represent the distributed RLC e ects in 3D interconnect. A few computationalresults are presented, mostly to point out the problems yet to be addressed.
Mattan Kamon, Nuno Alexandre Marques, Yehia Massou
Added 02 Aug 2010
Updated 02 Aug 2010
Type Conference
Year 1999
Where DAC
Authors Mattan Kamon, Nuno Alexandre Marques, Yehia Massoud, Luis Miguel Silveira, Jacob White
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