Abstract— Networks-on-chip (NoC) is emerging as a key onchip communication architecture for multiprocessor systemson-chip (MPSoC). In traditional electronic NoCs, high bandwidth can be obtained by increasing the number of parallel metallic wires at the cost of more energy consumption. Optical NoCs are thus proposed to achieve low-power ultra-highbandwidth data transmission in optical domain. Electronic control technology could be a complement to the optical networks. Besides NoCs, three-dimensional integrated circuits (3D ICs) are another attractive solution for system performance improvement by reducing the interconnect length. The investigation of using 3D IC as a platform for the realization of mixed-technology electronic-controlled optical NoC has not been addressed until recently. In this paper, we propose a 3D electronic-controlled optical NoC implemented in a TSV-based (through-silicon via) two-layer 3D chip. The upper device layer is an optical layer. It integrates an optical...