Hierarchical distributed simulation for 300mm wafer fab

Distributed simulation promises benefits in large-scale simulations, such as in high fidelity simulation of 300mm wafer fabs, although these benefits have been hard to achieve in practice. This paper examines the fundamentals of distributed simulation, and proposes a hierarchical approach to distributed wafer fab simulation, which has the potential to achieve significant reduction in model execution time.

• Type: Conference
• Year: 2007
• Where: WSC
• Authors: Sheng Xu, Leon F. McGinnis
• Keywords: Modeling And Simulation, Simulation Promises Benefits, Wafer Fab, Wafer Fab Simulation, WSC 2007