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25

CORR
2008
Springer

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High Density Through Silicon Via (TSV)

14 years 9 days ago

High Density Through Silicon Via (TSV)

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The Through Silicon Via (TSV) process developed by Silex provides down to 30

Magnus Rimskog, Tomas Bauer

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CORR 2008 | Education | Mems | Wafer Connections | µm Pitch |

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Added	25 Dec 2010
Updated	25 Dec 2010
Type	Journal
Year	2008
Where	CORR
Authors	Magnus Rimskog, Tomas Bauer

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