Physical mapping and performance study of a multi-clock 3-Dimensional Network-on-Chip mesh

—The physical performance of a 3-Dimensional Network-on-Chip (NoC) mesh architecture employing Through Silicon Vias (TSV) for vertical connectivity is investigated with a cycle-accurate RTL simulator. The physical latency and area impact of TSVs, switches, and the on-chip interconnect is evaluated to extract the maximum signaling speeds through the switches, horizontal and vertical network links. The relatively low parasitics of TSVs compared to the on-chip 2-D interconnect allow for higher signaling speeds between chip layers. The systemlevel impact on overall network performance as a result of clocking vertical packets at a higher rate through the TSV interconnect is simulated and reported.

• Type: Conference
• Year: 2009
• Where: 3DIC
• Authors: Matt Grange, Awet Yemane Weldezion, Dinesh Pamunuwa, Roshan Weerasekera, Zhonghai Lu, Axel Jantsch, Dave Shippen
• Keywords: 3DIC 2009, Hardware, On-chip 2-D Interconnect, On-chip Interconnect, Signaling Speeds