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Multicore architectures, which have multiple processing units on a single chip, have been adopted by most chip manufacturers. Most such chips contain on-chip caches that are share...
Abstract—A rising horizon in chip fabrication is the 3D integration technology. It stacks two or more dies vertically with a dense, highspeed interface to increase the device den...
Xiuyi Zhou, Jun Yang 0002, Yi Xu, Youtao Zhang, Ji...
It is widely accepted that transient failures will appear more frequently in chips designed in the near future due to several factors such as the increased integration scale. On th...
Background: Microscopists are familiar with many blemishes that fluorescence images can have due to dust and debris, glass flaws, uneven distribution of fluids or surface coatings...
This paper deals with placing chips on an MCM substrate in chip array style for minimizing the system failure rate. The placement procedure begins with constructing an initial pla...
Background: High density oligonucleotide tiling arrays are an effective and powerful platform for conducting unbiased genome-wide studies. The ab initio probe selection method emp...
Srinka Ghosh, Heather A. Hirsch, Edward A. Sekinge...
Background: Gene expression microarray experiments are expensive to conduct and guidelines for acceptable quality control at intermediate steps before and after the samples are hy...
Lesley Jones, Darlene R. Goldstein, Gareth P. Hugh...
The fabrication and experimental characterization of a thermal flow meter, capable of detecting and measuring two independent gas flows with a single chip, is described. The device...
Background: Recent genome wide transcription factor binding site or chromatin modification mapping analysis techniques, such as chromatin immunoprecipitation (ChIP) linked to DNA ...
Abstract-The network on chip will become a future general purpose interconnect for FPGAs much like today's standard OPB or PLB bus architectures. However, performance characte...