In this paper, we for the rst time present experimental evidence that the die surface can act as an RC interconnect, becoming an important factor in determining the voltage of a oating wire created by a CMOS open. We present a circuit model for this e ect veri ed with HSPICE simulations. A detailed analysis of potential mechanisms behind this phenomenon is provided. We also present our measurement results for the trapped charge deposited on oating gates during fabrication.
Haluk Konuk, F. Joel Ferguson