7 search results - page 1 / 2 » 3D Processing Technology and Its Impact on iA32 Microprocess... |
ICCD
2004
IEEE
14 years 7 months ago
2004
IEEE
This short paper explores an implementation of a new technology called 3D die stacking and describes research activity at Intel. 3D die stacking is the bonding of two die either f...
MICRO
2008
IEEE
14 years 5 months ago
2008
IEEE
— As semiconductor processing techniques continue to scale down, transient faults, also known as soft errors, are increasingly becoming a reliability threat to high-performance m...
MICRO
2006
IEEE
14 years 4 months ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
ASPDAC
2006
ACM
14 years 4 months ago
2006
ACM
- Although the emerging three-dimensional integration technology can significantly reduce interconnect delay, chip area, and power dissipation in nanometer technologies, its impact...
ICIP
2003
IEEE
15 years 12 days ago
2003
IEEE
Highly scalable video compression based on invertible motion adaptive lifting transforms has emerged as a promising area in image processing research and an important component in...