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132
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ICCAD
2005
IEEE
16 years 15 days ago
2005
IEEE
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
129
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SOSP
2005
ACM
16 years 15 days ago
2005
ACM
Commodity file systems trust disks to either work or fail completely, yet modern disks exhibit more complex failure modes. We suggest a new fail-partial failure model for disks, ...
125
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SOSP
2007
ACM
16 years 15 days ago
2007
ACM
ion Flow Control for Standard OS Abstractions Maxwell Krohn Alexander Yip Micah Brodsky Natan Cliffer M. Frans Kaashoek Eddie Kohler† Robert Morris MIT CSAIL †UCLA http://flum...
178
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ASPLOS
2010
ACM
15 years 10 months ago
2010
ACM
Scalable heterogeneous computing systems, which are composed of a mix of compute devices, such as commodity multicore processors, graphics processors, reconfigurable processors, ...
125
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CHI
2010
ACM
15 years 10 months ago
2010
ACM
Painting on 3D surfaces is an important operation in computer graphics, virtual reality, and computer aided design. The painting styles in existing WYSIWYG systems can be awkward,...