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ICCAD
2005
IEEE
118views Hardware» more  ICCAD 2005»
14 years 4 months ago
Thermal via planning for 3-D ICs
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
Jason Cong, Yan Zhang
ICCAD
2006
IEEE
99views Hardware» more  ICCAD 2006»
14 years 4 months ago
Information theoretic approach to address delay and reliability in long on-chip interconnects
With shrinking feature size and growing integration density in the Deep Sub-Micron technologies, the global buses are fast becoming the “weakest-links” in VLSI design. They ha...
Rohit Singhal, Gwan S. Choi, Rabi N. Mahapatra
ICPR
2006
IEEE
14 years 8 months ago
Adaptive Discriminant Projection for Content-based Image Retrieval
Content-based Image Retrieval (CBIR) is a computer vision application that aims at automatically retrieving images based on their visual content. Linear Discriminat Analysis and i...
Jie Yu, Qi Tian
CLUSTER
2008
IEEE
14 years 2 months ago
Empirical-based probabilistic upper bounds for urgent computing applications
—Scientific simulation and modeling often aid in making critical decisions in such diverse fields as city planning, severe weather prediction and influenza modeling. In some o...
Nick Trebon, Peter H. Beckman
AOSE
2007
Springer
14 years 1 months ago
A Goal-Oriented Software Testing Methodology
Abstract. Agent-Oriented Software Engineering (AOSE) methodologies are proposed to develop complex distributed systems based upon the agent paradigm. The natural implementation for...
Duy Cu Nguyen, Anna Perini, Paolo Tonella