21108 search results - page 4034 / 4222 » A General Class of Models of |
EUROSYS
2006
ACM
14 years 7 months ago
2006
ACM
Building content-based search tools for feature-rich data has been a challenging problem because feature-rich data such as audio recordings, digital images, and sensor data are in...
EUROSYS
2006
ACM
14 years 7 months ago
2006
ACM
Distributed systems are hard to build, profile, debug, and test. Monitoring a distributed system – to detect and analyze bugs, test for regressions, identify fault-tolerance pr...
ICCD
2001
IEEE
14 years 7 months ago
2001
IEEE
Dynamic power is the main source of power consumption in CMOS circuits. It depends on the square of the supply voltage. It may significantly be reduced by scaling down the supply ...
ICCAD
2005
IEEE
14 years 7 months ago
2005
IEEE
Abstract— We present in this paper a new interconnect-driven multilevel floorplanning, called IMF, to handle large-scale building-module designs. Unlike the traditional multilev...
ICCAD
2005
IEEE
14 years 7 months ago
2005
IEEE
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....