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DATE
2005
IEEE
14 years 1 months ago
2005
IEEE
Inductive cross-talk within IC packaging is becoming a significant bottleneck in high-speed inter-chip communication. The parasitic inductance within IC packaging causes bounce o...
3DIC
2009
IEEE
14 years 2 months ago
2009
IEEE
Abstract—In 3DICs heat dissipating devices are stacked directly on top of each other leading to a higher heat density than in a comparable 2D chip. 3D integration also moves the ...
ICCAD
2001
IEEE
14 years 4 months ago
2001
IEEE
This paper presents both compact analytical models and fast SPICE based 3-D electro-thermal simulation methodology to characterize thermal effects due to Joule heating in high per...
STACS
1999
Springer
13 years 12 months ago
1999
Springer
We investigate the problem of routing traffic through a congested network in an environment of non-cooperative users. We use the worst-case coordination ratio suggested by Koutsou...
TARK
1998
Springer
13 years 12 months ago
1998
Springer
If one has attributed certain initial beliefs to an agent, it is sometimes possible to reason about further beliefs the agent must hold by observing what conclusions one's ow...