With the rapid performance improvements in low-cost PCs, it becomes increasingly practical and cost-effective to implement large-scale video-on-demand (VoD) systems around parallel...
Current VLSI technology allows more than two wiring layers and the number is expected to rise in future. In this paper, we show that, by designing VLSI layouts directly for an L-l...
Chi-Hsiang Yeh, Emmanouel A. Varvarigos, Behrooz P...
On-chip interconnection networks (OCINs) have emerged as a modular and scalable solution for wire delay constraints in deep submicron VLSI design. OCIN research has shown that the ...
Avinash Karanth Kodi, Ashwini Sarathy, Ahmed Louri
The MultiNoC system implements a programmable onchip multiprocessing platform built on top of an efficient, low area overhead intra-chip interconnection scheme. The employed inter...
Design Constraints imposed by global interconnect delays as well as limitations in integration of disparate technologies make 3-D chip stacks an enticing technology solution for m...
Awet Yemane Weldezion, Matt Grange, Dinesh Pamunuw...