7452 search results - page 118 / 1491 » A Semantics for Multiprocessor Systems |
105
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DSD
2009
IEEE
15 years 10 months ago
2009
IEEE
— 3D stacked architectures provide significant benefits in performance, footprint and yield. However, vertical stacking increases the thermal resistances, and exacerbates tempe...
126
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RTSS
2009
IEEE
15 years 10 months ago
2009
IEEE
—Chip-multiprocessors represent a dominant new shift in the field of processor design. Better utilization of such technology in the real-time context requires coordinated approa...
147
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CODES
2007
IEEE
15 years 10 months ago
2007
IEEE
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
135
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ICPADS
2006
IEEE
15 years 9 months ago
2006
IEEE
One of the major factors that can potentially slow down widespread use of embedded chip multiprocessors is lack of efficient software support. In particular, automated code paral...
179
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ISCA
2005
IEEE
15 years 9 months ago
2005
IEEE
With the ability to place large numbers of transistors on a single silicon chip, manufacturers have begun developing chip multiprocessors (CMPs) containing multiple processor core...