In this paper, we propose two methods used in 3D IC placement that effectively exploit the die-to-die thermal coupling in the stack. First, TSVs are spread on each die to reduce t...
Sensor network processors and their applications are a growing area of focus in computer system research and design. Inherent to this design space is a reduced processing performa...
Leyla Nazhandali, Bo Zhai, Javin Olson, Anna Reeve...
High-performance and low-power VLIW DSP processors are increasingly deployed on embedded devices to process video and multimedia applications. For reducing power and cost in desig...
– Interconnect issues are becoming increasingly important for ULSI systems. IntSim, an interconnect CAD tool, has been developed to obtain pitches of different wiring levels and ...
Deepak C. Sekar, Azad Naeemi, Reza Sarvari, Jeffre...
Smart cards are vulnerable to both invasive and non-invasive attacks. Specifically, non-invasive attacks using power and timing measurements to extract the cryptographic key has d...
Hendra Saputra, Narayanan Vijaykrishnan, Mahmut T....