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» A comparative study of power efficient SRAM designs
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ASPDAC
2007
ACM
109views Hardware» more  ASPDAC 2007»
13 years 11 months ago
On Increasing Signal Integrity with Minimal Decap Insertion in Area-Array SoC Floorplan Design
Abstract-- With technology further scaling into deep submicron era, power supply noise become an important problem. Power supply noise problem is getting worse due to serious IR-dr...
Chao-Hung Lu, Hung-Ming Chen, Chien-Nan Jimmy Liu
ICCAD
2003
IEEE
123views Hardware» more  ICCAD 2003»
14 years 4 months ago
Full-Chip Interconnect Power Estimation and Simulation Considering Concurrent Repeater and Flip-Flop Insertion
In this paper, we study the full-chp interconnect power modeling. ,We show that repeater,insertion is no longer sufficient to achievethe targetfrequencies specifiedhy ITRS, and de...
Weiping Liao, Lei He
ICCAD
2006
IEEE
124views Hardware» more  ICCAD 2006»
14 years 4 months ago
Simultaneous power and thermal integrity driven via stapling in 3D ICs
The existing work on via-stapling in 3D integrated circuits optimizes power and thermal integrity separately and uses steadystate thermal analysis. This paper presents the first ...
Hao Yu, Joanna Ho, Lei He
IJAHUC
2006
129views more  IJAHUC 2006»
13 years 7 months ago
Optimal distance geographic routing for energy efficient wireless sensor networks
: Wireless sensor networks require energy efficient routing protocols owing to limited resource on the sensor node. In this paper, we develop optimal distance geographic routing (O...
Xin-Ming Huang, Jing Ma
AR
2006
164views more  AR 2006»
13 years 7 months ago
Design of an electrically actuated lower extremity exoskeleton
Human exoskeletons add the strength and endurance of robotics to a human's innate intellect and adaptability to help people transport heavy loads over rough, unpredictable ter...
Adam Zoss, Hami Kazerooni