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ICCAD
2005
IEEE
118views Hardware» more  ICCAD 2005»
14 years 4 months ago
Thermal via planning for 3-D ICs
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
Jason Cong, Yan Zhang
FPGA
2005
ACM
80views FPGA» more  FPGA 2005»
14 years 1 months ago
Simultaneous timing-driven placement and duplication
Logic duplication is an effective method for improving circuit performance. In this paper we present an algorithm named SPD that performs simultaneous placement and duplication to...
Gang Chen, Jason Cong
SIGCOMM
2010
ACM
13 years 7 months ago
Greening backbone networks: reducing energy consumption by shutting off cables in bundled links
In backbone networks, the line cards that drive the links between neighboring routers consume a large amount of energy. Since these networks are typically overprovisioned, selecti...
Will Fisher, Martin Suchara, Jennifer Rexford
NETWORKS
2010
13 years 6 months ago
A branch-and-cut algorithm for partition coloring
Let G = (V, E, Q) be a undirected graph, where V is the set of vertices, E is the set of edges, and Q = {Q1, . . . , Qq} is a partition of V into q subsets. We refer to Q1, . . . ...
Yuri Frota, Nelson Maculan, Thiago F. Noronha, Cel...
4OR
2010
148views more  4OR 2010»
13 years 5 months ago
Point-to-point shortest paths on dynamic time-dependent road networks
This a summary of the author's PhD thesis supervised by Leo Liberti, Philippe Baptiste and Daniel Krob and defended on 18 June 2009 at Ecole Polytechnique, Palaiseau, France. ...
Giacomo Nannicini