212 search results - page 25 / 43 » A snap-on placement tool |
ASPDAC
2011
ACM
12 years 11 months ago
2011
ACM
3-D monolithic integration (3DMI), also termed as sequential integration, is a potential technology for future gigascale circuits. Since the device layers are processed in sequent...
ICCD
2006
IEEE
14 years 4 months ago
2006
IEEE
Abstract— Timing and low power emerge as the most important goals in contemporary design. Meanwhile, the majority of placement algorithms developed by industry and academia still...
SLIP
2009
ACM
14 years 2 months ago
2009
ACM
An accurate model for pre-placement wire length estimation can be a useful tool during the physical design of integrated circuits. In this paper, an a priori wire length estimatio...
ISCA
2007
IEEE
14 years 1 months ago
2007
IEEE
The ever increasing sizes of on-chip caches and the growing domination of wire delay necessitate significant changes to cache hierarchy design methodologies. Many recent proposal...
ISQED
2007
IEEE
14 years 1 months ago
2007
IEEE
With the increasing size and sophistication of circuits and specifically in the presence of IP blocks, new wirelength estimation methods are needed in the design flow of large-sca...