1137 search results - page 222 / 228 » A study of slipstream processors |
IISWC
2006
IEEE
14 years 1 months ago
2006
IEEE
— As x86-64 processors become the CPU of choice for the personal computer market, it becomes increasingly important to understand the performance we can expect by migrating appli...
IPPS
2006
IEEE
14 years 1 months ago
2006
IEEE
High-performance multiprocessor systems built around out-of-order processors with aggressive branch predictors execute many memory references that turn out to be on a mispredicted...
MICRO
2006
IEEE
14 years 1 months ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
CASES
2006
ACM
14 years 1 months ago
2006
ACM
Virtual caches are employed as L1 caches of both high performance and embedded processors to meet their short latency requirements. However, they also introduce the synonym proble...
ISLPED
2006
ACM
14 years 1 months ago
2006
ACM
As transistors continue to scale down into the nanometer regime, device leakage currents are becoming the dominant cause of power dissipation in nanometer caches, making it essent...