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» A technique for minimizing power during FPGA placement
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ICCAD
2007
IEEE
124views Hardware» more  ICCAD 2007»
14 years 4 months ago
3D-STAF: scalable temperature and leakage aware floorplanning for three-dimensional integrated circuits
Abstract— Thermal issues are a primary concern in the threedimensional (3D) integrated circuit (IC) design. Temperature, area, and wire length must be simultaneously optimized du...
Pingqiang Zhou, Yuchun Ma, Zhuoyuan Li, Robert P. ...
ISCAPDCS
2007
13 years 8 months ago
Evaluation of architectural support for speech codecs application in large-scale parallel machines
— Next generation multimedia mobile phones that use the high bandwidth 3G cellular radio network consume more power. Multimedia algorithms such as speech, video transcodecs have ...
Naeem Zafar Azeemi
DAC
1996
ACM
13 years 11 months ago
Use of Sensitivities and Generalized Substrate Models in Mixed-Signal IC Design
A novel methodology for circuit design and automatic layout generation is proposed for a class of mixed-signal circuits in presence of layout parasitics and substrate induced nois...
Paolo Miliozzi, Iasson Vassiliou, Edoardo Charbon,...
ICCAD
2006
IEEE
141views Hardware» more  ICCAD 2006»
14 years 4 months ago
A code refinement methodology for performance-improved synthesis from C
Although many recent advances have been made in hardware synthesis techniques from software programming languages such as C, the performance of synthesized hardware commonly suffe...
Greg Stitt, Frank Vahid, Walid A. Najjar
ICCAD
2007
IEEE
128views Hardware» more  ICCAD 2007»
14 years 4 months ago
Module assignment for pin-limited designs under the stacked-Vdd paradigm
Abstract— This paper addresses the module assignment problem in pinlimited designs under the stacked-Vdd circuit paradigm. A partition-based algorithm is presented for efficient...
Yong Zhan, Tianpei Zhang, Sachin S. Sapatnekar