1020 search results - page 140 / 204 » Advanced Teleoperation Architecture |
141
Voted
DAC
2007
ACM
16 years 4 months ago
2007
ACM
Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...
116
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DAC
2007
ACM
16 years 4 months ago
2007
ACM
Adaptation in embedded processing is key in order to address efficiency. The concept of extensible embedded processors works well if a few a-priori known hot spots exist. However,...
103
Voted
DAC
2007
ACM
16 years 4 months ago
2007
ACM
We propose a design and optimization methodology for high performance and ultra low power digital applications on flexible substrate using Low Temperature Polycrystalline Silicon ...
120
Voted
DAC
1999
ACM
16 years 4 months ago
1999
ACM
We illustrate how technical contributions in the VLSI CAD partitioning literature can fail to provide one or more of: (i) reproducible results and descriptions, (ii) an enabling a...
118
Voted
DAC
2003
ACM
16 years 4 months ago
2003
ACM
Recent advances in tester technology have led to automatic test equipment (ATE) that can operate at up to several hundred MHz. However, system-on-chip (SOC) scan chains typically ...